Analysis

Linear transient heat transfer analysis of a cooling fin with thermal flux from an electrical component, dissipating heat through natural convection modeled using Optistruct Solver on Altair Hyperworks

Topology optimization of solid elements for a control arm assembly developed using Optistruct to minimize volume while withstanding forces for breaking, cornering and pot-hole considering manufacturing constraints pertaining to symmetry and draw directions.

Topology optimization of shell elements for a hook assembly developed using Optistruct to minimize volume while withstanding forces from static loading considering manufacturing constraints.

Thermal stress analysis carried over a printed circuit board model with shell and solid elements taking substrate material anisotropy into consideration along with structural constraints of mount holes